| 释义 |
thermal compression bonding
- 头压缩tóu yā suō
hearder compression
- 耦合力ǒu hé lì
bonding force
- 芯片焊接xīn piàn hàn jiē
chip bonding; die bonding; die attachment
- 缝焊féng hàn
slit bonding
- 烫的tàng de
thermal
- 密集mì jí
coarctation, compression, denseness
- 耐压力nài yā lì
compression resistance
- 键合jiàn hé
bonding; linking; linkage
- 交联jiāo lián
crosslinking; cross bonding
- 文件压缩wén jiàn yā suō
file compression
- 压缩率yā suō lǜ
compressibility, compression ratio
- 导热性dǎo rè xìng
conductivity for heat; temperature conductivity; thermal conductance; thermal
- 热赤道rè chì dào
thermal equator
- 热扩散rè kuò sàn
thermal diffusion
- 热容量rè róng liàng
thermal capacity
- 热污染rè wū rǎn
thermal pollution
- 热效率rè xiào lǜ
thermal efficiency
- 热中子rè zhōng zǐ
thermal neutron
- 芯片焊盘xīn piàn hàn pán
chip bonding pad
- 粘合zhān hé
conglutinate; glue; adhesion; bonding; cohere
- 热反应堆rè fǎn yīng duī
thermal reactor
- 热辐射rè fú shè
thermal radiation; caloradiance
- 热量单位rè liàng dān wèi
thermal unit
- 热量的rè liàng de
caloric, thermal, thermic
- 担保公司dān bǎo gōng sī
bonding company; guarantee company
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