SiP（System in Package） SiP（系统级封装）为一种封装的概念，是将一个系统或子系统的全部或大部份电子功能配置在集成型基板内，而芯片以2D、3D的方式接合到集成型基板的封装方式。

SIP不仅可以组装多个芯片，还可以作为一个专门的处理器、DRAM、闪存与被动组件结合电阻器和电容器、连接器、天线等，全部安装在同一基板上上。这意味着，一个完整的功能单位可以建在一个多芯片封装，因此，需要添加少量的外部组件，使其工作。

SiP技术包括：

SiP较Soc降低系统成本，显著减小封装体积、重量，还可以降低功耗。

A system in package (SiP) or system-in-a-package is a number of integrated circuits enclosed in a single module (package). The SiP performs all or most of the functions of an electronic system, and is typically used inside a mobile phone, digital music player, etc. Dies containing integrated circuits may be stacked vertically on a substrate. They are internally connected by fine wires that are bonded to the package. Alternatively, with a flip chip technology, solder bumps are used to join stacked chips together.