脉冲雷射沉积（Pulsed Laser Deposition，PLD），也被称为脉冲雷射烧蚀（pulsed laser abalation，PLA）为物理气相沉积的一种(Physical Vapor Deposition，PVD)

是一种利用聚焦后的高功率脉冲雷射于真空腔体中对靶材进行轰击，由于雷射能量极强，会将靶材汽化形成电浆蕈状团(plasma plume)，并沉淀于基板上形成薄膜。

于镀膜可于高真空、超高真空或通入工作气体(如欲沉积氧化物薄膜，通常会通入氧气作为其工作气体)的环境下进行。

于脉冲雷射沉积的过程中，雷射的能量被靶材吸收之后，能量首先激发靶材内部的电子跃迁，之后再转成热能等使靶材汽化形成电浆态，于电浆云中，包含分子、原子、电子、离子、微粒、融球体等物质。

Pulsed laser deposition (PLD) is a physical vapor deposition (PVD) technique where a high-power pulsed laser beam is focused inside a vacuum chamber to strike a target of the material that is to be deposited. This material is vaporized from the target (in a plasma plume) which deposits it as a thin film on a substrate (such as a silicon wafer facing the target). This process can occur in ultra high vacuum or in the presence of a background gas, such as oxygen which is commonly used when depositing oxides to fully oxygenate the deposited films.