| 释义 |
interparticle bonding
- 耦合力ǒu hé lì
bonding force
- 芯片焊接xīn piàn hàn jiē
chip bonding; die bonding; die attachment
- 缝焊féng hàn
slit bonding
- 键合jiàn hé
bonding; linking; linkage
- 交联jiāo lián
crosslinking; cross bonding
- 芯片焊盘xīn piàn hàn pán
chip bonding pad
- 粘合zhān hé
conglutinate; glue; adhesion; bonding; cohere
- 担保公司dān bǎo gōng sī
bonding company; guarantee company
- 焊接周期hàn jiē zhōu qī
welding interval; bonding cycle; weld cycle; welding cycle
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