1. Copper conductive adhesives were prepared using epoxy as matrix, the mixture of m-phenylenediamine and diaminodiphenylmethane as hardener, and copper particles as the conducting filler.
   以环氧树脂为基体,间苯二胺和二氨基二苯甲烷的低融点混合物为固化剂,铜粉为导电填料,制备了热固化各向同性导电胶。

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