释义 |
bonding technology
- interchangeabilityn. 可交换[交替]性
- 耦合力ǒu hé lì
bonding force
- 芯片焊接xīn piàn hàn jiē
chip bonding; die bonding; die attachment
- 建筑技术jiàn zhù jì shù
building technology; architectural technology; construction technology
- 缝焊féng hàn
slit bonding
- 创新科技chuàng xīn kē jì
creative technology; innovative technology
- 领先技术lǐng xiān jì shù
lead-edge technologies; leading technologies
- 键合jiàn hé
bonding; linking; linkage
- 交联jiāo lián
crosslinking; cross bonding
- 技术贸易jì shù mào yì
trade in technology; technology transference
- 计算机应用技术jì suàn jī yīng yòng jì shù
CAT(computer application technology)
- 芯片焊盘xīn piàn hàn pán
chip bonding pad
- 粘合zhān hé
conglutinate; glue; adhesion; bonding; cohere
- 科技与社会kē jì yǔ shè huì
STS(science,technology and society); technology and society
- 汉字信息处理技术hàn zì xìn xī chù lǐ jì shù
technology of Chinese information processing
- 引进技术yǐn jìn jì shù
introduction of technology; introduced technology; import of foreign talents
- 工业技术gōng yè jì shù
technology
- 科技kē jì
science and technology
- 科学技术kē xué jì shù
technology
- 硬技术yìng jì shù
hard technology
- 担保公司dān bǎo gōng sī
bonding company; guarantee company
- 陶瓷工艺原理táo cí gōng yì yuán lǐ
principle of pottery technology; principles of ceramic technology
- 技术转让jì shù zhuǎn ràng
technical transformation; transfer of skill; transfer of technology; technology
- 锻压工艺duàn yā gōng yì
Forging Technology
- 锻造工艺duàn zào gōng yì
Forging Technology
- 蜂窝技术fēng wō jì shù
cellular technology
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