| 释义 |
Bonding,Hydrogen
- 耦合力ǒu hé lì
bonding force
- 芯片焊接xīn piàn hàn jiē
chip bonding; die bonding; die attachment
- 缝焊féng hàn
slit bonding
- 氢qīng
hydrogen (H)
- 氢气qīng qì
hydrogen
- 键合jiàn hé
bonding; linking; linkage
- 交联jiāo lián
crosslinking; cross bonding
- 氨ān
ammonia; hydrogen nitride
- 氢键qīng jiàn
hydrogen bond
- 氘化氢dāo huà qīng
hydrogen deuteride
- 氟化氢fú huà qīng
hydrogen fluoride
- 硫化氢liú huà qīng
sulfureted hydrogen
- 氢电极qīng diàn jí
hydrogen electrode
- 氢化硫qīng huà liú
hydrogen sulfide
- 重氢zhòng qīng
diplogen, heavy hydrogen
- 芯片焊盘xīn piàn hàn pán
chip bonding pad
- 粘合zhān hé
conglutinate; glue; adhesion; bonding; cohere
- 氢离子qīng lí zǐ
hydrion; hydrogen ion
- 砷化氢shēn huà qīng
arsine; arsenide hydrogen
- 担保公司dān bǎo gōng sī
bonding company; guarantee company
- 过氧化氢guò yǎng huà qīng
perhydrol; hydrogen peroxide
- 氯化氢lǜ huà qīng
hydrogen chloride; chlorine hydride
- 氰化氢qíng huà qīng
hydrogen cyanide; hydrocyanic acid
- 氢弹qīng dàn
superatomic bomb; super bomb; hydrogen bomb
- 碳氢化合物tàn qīng huà hé wù
hydrocarbon; carbureted hydrogen
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