Wire bonding is the method of making interconnections between an integrated circuit (IC) or other semiconductor device and its packaging during semiconductor device fabrication. Although less common, wire bonding can be used to connect an IC to other electronics or to connect from one printed circuit board (PCB) to another. Wire bonding is generally considered the most cost-effective and flexible interconnect technology, and is used to assemble the vast majority of semiconductor packages. If properly designed, wire bonding can be used at frequencies above 100 GHz.<ref name="V. Valenta et al., "Design and experimental evaluation of compensated bondwire interconnects above 100 GHz">V. Valenta et al., "Design and experimental evaluation of compensated bondwire interconnects above 100 GHz, International Journal of Microwave and Wireless Technologies, 2015</ref>