Wedge bonding

Wedge bonding is a kind of wire bonding which relies on the application of ultrasonic power and force to form bonds. It is a popular method and is commonly used in the semiconductor industry. Wire bonders typically require threading a 25 µm diameter wire through an minuscule hole.

单词	Wedge bonding
释义	Wedge bonding 英语百科 Wedge bonding Wedge bonding is a kind of wire bonding which relies on the application of ultrasonic power and force to form bonds. It is a popular method and is commonly used in the semiconductor industry. Wire bonders typically require threading a 25 µm diameter wire through an minuscule hole.
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