| 释义 |
wafer cutting
- undercuttingn. 消弱；削价；凹割；掏槽；截槽
- overcoatingn. 外敷层(保护涂层)
- forgettingn. 遗忘
- 割炬gē jù
cutting blowpipe; cutting torch
- 圣饼shèng bǐng
wafer
- 圆片yuán piàn
wafer
- 裁断机cái duàn jī
cutting machine
- 裁剪机cái jiǎn jī
cutting machines
- 锋芒fēng máng
cutting edge; spearhead
- 挖土wā tǔ
earth cutting; cut
- 掠夺性竟争削价luě duó xìng jìng zhēng xuē jià
predatory price cutting
- 干胶片gàn jiāo piàn
wafer
- 錾锉砧zàn cuò zhēn
cutting block; file cutting anvil
- 外圆车削wài yuán chē xuē
cylindrical lathe cutting; cylindrical turning
- 晶片jīng piàn
chip; crystal plate; wafer
- 芯片xīn piàn
slug; chip; die; wafer
- 极薄jí báo
as thin as a wafer
- 锯切jù qiē
saw cutting
- 开凿kāi záo
cutting, excavate
- 刃口rèn kǒu
cutting edge
- 篆刻zhuàn kè
seal cutting
- 刀模dāo mó
die; cutting die
- 伐期龄fá qī líng
cutting age
- 掐蛹qiā yǒng
cutting off pelettes
- 线切割xiàn qiē gē
wire-electrode cutting
- 仿形切割fǎng xíng qiē gē
shape cutting
- 剪报jiǎn bào
press clipping, press cutting
- 切下qiē xià
chip off, cutting, slice
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