Thermosonic bonding

Thermosonic Bonding is the most widely used wire bonding method to electrically connect silicon integrated circuits. It was introduced by Alexander Coucoulas in the 1960s. Owing to the reliability of thermosonic bonds, they are used extensively to connect central processing units (CPUs), which are encapsulated integrated circuits that serve as the "brains" of a computer.

单词	Thermosonic Bonding
释义	Thermosonic Bonding 英语百科 Thermosonic bonding Thermosonic Bonding is the most widely used wire bonding method to electrically connect silicon integrated circuits. It was introduced by Alexander Coucoulas in the 1960s. Owing to the reliability of thermosonic bonds, they are used extensively to connect central processing units (CPUs), which are encapsulated integrated circuits that serve as the "brains" of a computer.
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