Solder ball

In integrated circuit packaging, a solder ball, also a solder bump (ofter referred to simply as "ball" or "bumps") is a ball of solder that provides the contact between the chip package and the printed circuit board, as well as between stacked packages in multichip modules. The solder balls can be placed manually or by automated equipment, and are held in place with a tacky flux.

单词	Solder ball
释义	Solder ball 英语百科 Solder ball In integrated circuit packaging, a solder ball, also a solder bump (ofter referred to simply as "ball" or "bumps") is a ball of solder that provides the contact between the chip package and the printed circuit board, as well as between stacked packages in multichip modules. The solder balls can be placed manually or by automated equipment, and are held in place with a tacky flux.
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