双列直插封装（英语：dual in-line package） 也称为DIP封装或DIP包装，简称为DIP或DIL，是一种集成电路的封装方式，集成电路的外形为长方形，在其两侧则有两排平行的金属引脚，称为排针。DIP包装的组件可以焊接在印刷电路板电镀的贯穿孔中，或是插入在DIP插座（socket）上。

DIP包装的组件一般会简称为DIPn，其中n是引脚的个数，例如十四针的集成电路即称为DIP14，右图即为DIP14的集成电路。

In microelectronics, a dual in-line package (DIP or DIL), or dual in-line pin package (DIPP) is an electronic component package with a rectangular housing and two parallel rows of electrical connecting pins. The package may be through-hole mounted to a printed circuit board or inserted in a socket. The dual-inline format was invented by Don Forbes, Rex Rice and Bryant Rogers at Fairchild R&D in 1964, when the restricted number of leads available on circular transistor-style packages became a limitation in the use of integrated circuits. Increasingly complex circuits required more signal and power supply leads (as observed in Rent's rule); eventually microprocessors and similar complex devices required more leads than could be put on a DIP package, leading to development of higher-density packages. Furthermore, square and rectangular packages made it easier to route printed-circuit traces beneath the packages.