| 释义 |
semiconductor device, filling for heating, cooling
- 半导体器件bàn dǎo tǐ qì jiàn
semiconductor device; semiconductor apparatus
- 油冷yóu lěng
oil cooling
- 采暖cǎi nuǎn
heating
- 供暖gòng nuǎn
heating
- 冷却水lěng què shuǐ
cooling water
- 冷却液lěng què yè
cooling fluid
- 充填物chōng tián wù
filling
- 馅儿xiàn ér
filling; stuffing
- 冷却系统lěng què xì tǒng
cooling system
- 灌装机guàn zhuāng jī
filling machine
- 铉xuàn
device for carrying a tripot
- 局部加热jú bù jiā rè
local heating; differential heating; district heating
- 窄禁带半导体zhǎi jìn dài bàn dǎo tǐ
narrow bandgap semiconductor
- 暖气nuǎn qì
central heating; heating installation
- 凉水塔liáng shuǐ tǎ
cooling tower; water cooling tower
- 错纬cuò wěi
mispick; change-in filling; mixed filling
- 汽车加油站qì chē jiā yóu zhàn
filling station
- 填隙tián xì
gap filling; shimming; chinse; interstitial
- 纬棱纹织物wěi léng wén zhī wù
filling reps
- 太阳能供暖tài yáng néng gòng nuǎn
solar heating
- 绷弓bēng gōng
device for preventing slamming of door
- 暖气管nuǎn qì guǎn
steam heating pipe; heating pipe
- 斗链式掐dòu liàn shì qiā
bucket brigade device; BBD
- 半导体bàn dǎo tǐ
semiconductor
- 块设备kuài shè bèi
block device
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