| 释义 |
semiconductor device bonding
- 半导体器件bàn dǎo tǐ qì jiàn
semiconductor device; semiconductor apparatus
- 耦合力ǒu hé lì
bonding force
- 窄禁带半导体zhǎi jìn dài bàn dǎo tǐ
narrow bandgap semiconductor
- 芯片焊接xīn piàn hàn jiē
chip bonding; die bonding; die attachment
- 斗链式掐dòu liàn shì qiā
bucket brigade device; BBD
- 半导体bàn dǎo tǐ
semiconductor
- 块设备kuài shè bèi
block device
- 矢量仪shǐ liàng yí
vectorscope device
- 缝焊féng hàn
slit bonding
- 串行设备chuàn háng shè bèi
serial device
- 复合设备fù hé shè bèi
compound device
- 音频设备yīn pín shè bèi
audio device
- 键合jiàn hé
bonding; linking; linkage
- 交联jiāo lián
crosslinking; cross bonding
- 遥控设备yáo kòng shè bèi
remote device, robot
- 锗半导体zhě bàn dǎo tǐ
germanium semiconductor
- 半导体物理bàn dǎo tǐ wù lǐ
semiconductor physics
- 掺杂半导体chān zá bàn dǎo tǐ
doped semiconductor
- 瞄准装置miáo zhǔn zhuāng zhì
collimation equipment; aiming device; sighting device
- 芯片焊盘xīn piàn hàn pán
chip bonding pad
- 粘合zhān hé
conglutinate; glue; adhesion; bonding; cohere
- 族半导体zú bàn dǎo tǐ
group iii v semiconductor
- 纹章wén zhāng
gad; device
- 摘钩zhāi gōu
decoupling device
- 担保公司dān bǎo gōng sī
bonding company; guarantee company
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