释义 |
semiconductor chip bonding
- 芯片焊接xīn piàn hàn jiē
chip bonding; die bonding; die attachment
- 芯片焊盘xīn piàn hàn pán
chip bonding pad
- 耦合力ǒu hé lì
bonding force
- 半导体器件bàn dǎo tǐ qì jiàn
semiconductor device; semiconductor apparatus
- 窄禁带半导体zhǎi jìn dài bàn dǎo tǐ
narrow bandgap semiconductor
- 薯片shǔ piàn
chips; crisps; potato chips; fried chips
- 敲渣锤qiāo zhā chuí
chipping hammer
- 半导体bàn dǎo tǐ
semiconductor
- 缝焊féng hàn
slit bonding
- 贴片机tiē piàn jī
chip mounter; chip shooter
- 芯片座xīn piàn zuò
chip carrier; chip holder
- 键合jiàn hé
bonding; linking; linkage
- 交联jiāo lián
crosslinking; cross bonding
- 锗半导体zhě bàn dǎo tǐ
germanium semiconductor
- 削片xuē piàn
chip
- 好斗hǎo dòu
have a chip on one's shoulder, pugnacity
- 蓝筹股lán chóu gǔ
blue chip; blue chip stock; blue-chip share
- 无关紧要之物wú guān jǐn yào zhī wù
a chip in porridge
- 半导体物理bàn dǎo tǐ wù lǐ
semiconductor physics
- 掺杂半导体chān zá bàn dǎo tǐ
doped semiconductor
- 粘合zhān hé
conglutinate; glue; adhesion; bonding; cohere
- 筹码chóu mǎ
chip; counter
- 刨削páo xuē
planing; chipping
- 片装piàn zhuāng
on chip
- 切球qiē qiú
cut; chipping
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