化学气相沉积（英语：Chemical Vapor Deposition，简称CVD）是一种用来产生纯度高、性能好的固态材料的化学技术。半导体产业使用此技术来成长薄膜。典型的CVD制程是将晶圆（基底）暴露在一种或多种不同的前趋物下，在基底表面发生化学反应或/及化学分解来产生欲沉积的薄膜。反应过程中通常也会伴随地产生不同的副产品，但大多会随着气流被带走，而不会留在反应腔（Reaction chamber）中。

微制程大都使用CVD技术来沉积不同形式的材料，包括单晶、多晶、非晶及磊晶材料。这些材料有硅、碳纤维、碳奈米纤维、奈米线、奈米碳管、SiO₂、硅锗、钨、硅碳、氮化硅、氮氧化硅及各种不同的high-k介质等材料。CVD制程也常用来生成合成钻石。

Chemical vapor deposition (CVD) is a chemical process used to produce high quality, high-performance, solid materials. The process is often used in the semiconductor industry to produce thin films. In typical CVD, the wafer (substrate) is exposed to one or more volatile precursors, which react and/or decompose on the substrate surface to produce the desired deposit. Frequently, volatile by-products are also produced, which are removed by gas flow through the reaction chamber.