Low pressure molding

Low Pressure Molding (LPM) with polyamide and polyolefin (hot-melt) materials is a process typically used to encapsulate and environmentally protect electronic components (such as circuit boards). The purpose is to protect electronics against moisture, dust dirt and vibration. Low Pressure Molding is also used for sealing connectors and molding grommets and strain reliefs.

单词	Low pressure molding
释义	Low pressure molding 英语百科 Low pressure molding Low Pressure Molding (LPM) with polyamide and polyolefin (hot-melt) materials is a process typically used to encapsulate and environmentally protect electronic components (such as circuit boards). The purpose is to protect electronics against moisture, dust dirt and vibration. Low Pressure Molding is also used for sealing connectors and molding grommets and strain reliefs.
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