| 释义 |
lead frame bonding
- 耦合力ǒu hé lì
bonding force
- 芯片焊接xīn piàn hàn jiē
chip bonding; die bonding; die attachment
- 框架kuàng jià
frame; framework; shell frame; skeleton frame; frame mount
- 咒线板zhòu xiàn bǎn
main distributing frame; MDF
- 领导的lǐng dǎo de
leading
- 阳畦yáng qí
cold frame
- 帧zhēn
frame; picture; frames
- 缝焊féng hàn
slit bonding
- 框式kuàng shì
frame; frame form
- 内骨架nèi gǔ jià
inner frame
- 眼镜架yǎn jìng jià
spectacle frame
- 键合jiàn hé
bonding; linking; linkage
- 交联jiāo lián
crosslinking; cross bonding
- 清客qīng kè
led capitain
- 马首是瞻mǎ shǒu shì zhān
follow sb.'s lead
- 参照系cān zhào xì
frame of reference
- 窗口框架chuāng kǒu kuàng jià
window frame
- 轻质车架qīng zhì chē jià
lightweight frame
- 中部肋骨zhōng bù lèi gǔ
midship frame
- 铅qiān
lead (Pb); lead (in a pencil); black lead
- 石墨shí mò
black lead, graphite, lead, plumbago, pot lead
- 烷基铅wán jī qiān
alkyl lead
- 玳瑁镜架dài mào jìng jià
turtle shell frame
- 惯性坐标系guàn xìng zuò biāo xì
inertial frame
- 框架坝kuàng jià bà
framed dam; frame weir
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