| 释义 |
infrared bonding material
- 红外线hóng wài xiàn
infrared, infrared ray
- 耦合力ǒu hé lì
bonding force
- 红外线的hóng wài xiàn de
infrared
- 芯片焊接xīn piàn hàn jiē
chip bonding; die bonding; die attachment
- 复合材料fù hé cái liào
composite material; composite
- 缝焊féng hàn
slit bonding
- 绮罗qǐ luó
figured woven silk material; damask
- 疏松材料shū sōng cái liào
bulk material; porous material
- 隔音材料gé yīn cái liào
deadening; deadener; acoustic insulating material; damping material; sound-proof
- 原材料yuán cái liào
raw and processed materials; raw material
- 料棚liào péng
material shed
- 覆盖材料fù gài cái liào
cladding material; coating material; cover material
- 饰面材料shì miàn cái liào
facing material; finish material; coating material
- 键合jiàn hé
bonding; linking; linkage
- 交联jiāo lián
crosslinking; cross bonding
- 料子liào zǐ
material for making clothes
- 鞣料róu liào
tanning material; tan; tannin
- 来料加工lái liào jiā gōng
accept customers' materials for processing
- 原料yuán liào
raw material; crude material; raw stuff; rough material; stock
- 堵水材料dǔ shuǐ cái liào
water shutoff material
- 回收的材料huí shōu de cái liào
recycled materials
- 就地取材jiù dì qǔ cái
use local materials
- 良品可使用liáng pǐn kě shǐ yòng
available material
- 裂变物质liè biàn wù zhì
fissionable material; fisser
- 芯片焊盘xīn piàn hàn pán
chip bonding pad
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