| 释义 |
heat setting bonding
- 耦合力ǒu hé lì
bonding force
- 残阳cán yáng
the setting sun
- 残照cán zhào
the setting sun
- 夕阳xī yáng
the setting sun
- 新设定xīn shè dìng
new settings
- 芯片焊接xīn piàn hàn jiē
chip bonding; die bonding; die attachment
- 采暖cǎi nuǎn
heating
- 供暖gòng nuǎn
heating
- 缝焊féng hàn
slit bonding
- 落日luò rì
setting sun; the setting sun
- 设置默认值shè zhì mò rèn zhí
default settings
- 热回收rè huí shōu
heat recovery; heat reclam; heat utilization
- 暑气shǔ qì
summer heat; heat
- 键合jiàn hé
bonding; linking; linkage
- 交联jiāo lián
crosslinking; cross bonding
- 赤热状态chì rè zhuàng tài
red heat
- 隔热gé rè
heat insulation; heat protection
- 祛暑qū shǔ
drive away summer heat
- 胜负不分shèng fù bú fèn
dead heat
- 正常血温zhèng cháng xuè wēn
blood heat
- 改变系统设置gǎi biàn xì tǒng shè zhì
change system settings
- 调整打印设置diào zhěng dǎ yìn shè zhì
adjust print settings
- 修改视图设置xiū gǎi shì tú shè zhì
modify view settings
- 设定shè dìng
setting
- 辐射热fú shè rè
radiant heat; radiogenic heat
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